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    1. 半導體行業精密工具

      宣傳畫冊

      半導體行業精密工具
      硅片、藍寶石片開槽砂輪

      產品詳細信息

      Grinding wheel for bevel machining of semiconductor material substrates. 

      Notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.

       

        Beveling silicon wafers Beveling sapphire wafers
      Notch machining Wheel size φ3.8×36L×11T×8U×1.4X φ3.8×36L×11T×8U×1.4X

       

       

       


      Features

       


      Even and ne diamond layer minimizes processing damage. 
      Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life. 
      Highly precise slotted shape and nishing technology support various wafer shapes. 
      Copper-less supported.

      Copyright ? 2002-2022 南京三超新材料股份有限公司 版權所有 蘇ICP備12002878號-1

      国产精品被窝福利一区
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